Good thermal conductivity performance to join CPU/GPU and heat sink together. CPU's heat can be passed to the heat sink faster and also Enhances the cooling effect of heat sink.

Primary Use: Thermal Coupling of electrical/electronic devices to heat sinks

TP30WH

Data sheet

Color
White
Thermal conductivity
>1.829 W/m-k.
Thermal resistance
>0.123 C-in2/w.
Dielectric breakdown
>5.0 KV ac.
Suitable
CPU, VGA
Weight
30g
Board Category
APU1
APU2
APU3
APU4
Return Warranty
Standard 30 Days
Manufacturer Warranty
1 Year Limited Warranty

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