The Cooling Fan U3 is a high-performance cooling solution designed for the ODROID-U3 single-board computer. It effectively dissipates heat, keeping your U3 running at optimal temperatures even during demanding tasks. With its compact design and efficient operation, this cooling fan ensures reliable performance and longevity for your U3 system.
The BISCUIT™ is a programmable Wi-Fi 9-axis absolute orientation sensor that offers a versatile solution for tracking and monitoring spatial movement. With its integrated Wi-Fi connectivity, it provides seamless wireless data transmission and precise orientation sensing capabilities. Unlock new possibilities in robotics, virtual reality, and motion...
The HiFi Shield Plus provides both stereo RCA connectors to connect to external amplifiers and other audio equipment. Via TI’s high-end PCM5242 DAC chip(known as Burr-Brown), it supports 16, 24, 32 bit audio formats with minimal THD+N ratio (0.002%) and ideal dynamics (114dB+), plus amazing sampling rates of 384kHz
U3 IO Shield is the board that can be plugged on the neat of ODROID-U3 via tiny 8 pin IO connector. You can have 36 IO ports of GPIO/PWM/ADC. The shape and dimension are exactly same as ODROID-U3. It comes with 12pcs of PCB spacers for easier and solid stacking assembly.
The UPS2 for C1 is designed specifically for the ODROID-C1. Uninterrupted Power Supply is an electrical apparatus that provides emergency power to a load when the input power source, typically mains power, fails. The on-battery runtime of most uninterruptible power sources is relatively short but sufficient to start a standby power source or properly shut...
Uninterrupted Power Supply is an electrical apparatus that provides emergency power to a load when the input power source, typically mains power, fails. The on-battery runtime of most uninterruptible power sources is relatively short but sufficient to start a standby power source or properly shut down the ODROID.
The ROM-WT138LM(N) series are remote control receiver modules. Pin diode and receiver IC are assembled on one module. Small- sized, light-weight, and low current consumption. modules have been achieved by using resin mold.
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